事关半导体材料！两款国产设备顺利交付

This project involves the development and commercialization of China's first domestically-developed 12-inch silicon carbide (SiC) ingot thinning and substrate thinning equipment. Successfully delivered to leading industry customers, these machines represent a breakthrough in large-diameter SiC processing technology. The initiative addresses critical bottlenecks in SiC substrate manufacturing by providing advanced thinning equipment previously dependent on foreign imports. The project demonstrates China's growing capability in semiconductor equipment innovation, specifically targeting the rapidly expanding SiC power device market driven by electric vehicles, renewable energy, and industrial applications.

Positioned as the premier domestic alternative to imported high-end SiC processing equipment, targeting Chinese semiconductor fabs and SiC substrate manufacturers. The value proposition combines advanced technical performance (achieving international standards) with cost-effectiveness, reliable local support, and customization for Chinese manufacturing environments. Strategic positioning focuses on import substitution amid growing geopolitical tensions and supply chain localization initiatives, while offering superior after-sales service and technical collaboration compared to foreign competitors.

• Ingot Thinner: Automated pickup and adsorption dual-mode transfer system ensuring stable, efficient handling of large 12-inch SiC ingots
• Substrate Thinner: Integrated ultra-precision air spindle and air-floating wafer stage for exceptional thickness control
• Thickness uniformity maintained within 1 micron across entire wafer surface
• High-throughput design reducing processing cycle time for mass production scalability
• Robust construction for consistent performance with large-diameter SiC materials
• Advanced process control systems ensuring repeatable quality and yield optimization

Global leaders: Applied Materials, Lam Research, Tokyo Electron (Japan), DISCO (Japan), Okamoto (Japan) dominate high-end semiconductor thinning equipment. Chinese domestic competitors: Advanced Micro-Fabrication Equipment (AMEC), NAURA Technology Group, and other emerging equipment makers. Key differentiation includes: first domestic 12-inch SiC thinning capability, specialized SiC process expertise (vs. general semiconductor equipment), cost advantage (30-50% lower than imports), and superior local technical support with faster response times. Partnership with China Electronics Technology Group Corporation provides credibility and access to domestic semiconductor ecosystem.

Primary revenue from equipment sales (estimated $2-5 million per system depending on configuration), supplemented by after-sales service contracts (15-20% of equipment value annually), spare parts, and process optimization services. Target customers include leading Chinese SiC substrate manufacturers (Tianke HeDian, SICC, etc.) and semiconductor fabs expanding SiC production. Consideration of equipment leasing or financing options to lower entry barriers. Potential government subsidies and tax incentives for domestic equipment adoption. Long-term strategy includes expanding product line to other SiC processing equipment (polishing, cleaning, metrology) and exploring export opportunities to other emerging semiconductor markets.